Thermal characterization of materials from the wide domain of electronics is a key competence of Nanotest. For different material classes we develop, refine and utilize methods and measurement systems, empowered by scientific judgement. We flexibly adapt to customer requirements and provide economical service offers for very individual studies.

Well-selected materials and components alone do not make a thermally performant system with high reliability and long lifetime expectancy. They need to match and act jointly, thermally and thermo-mechanically. Proper qualification is essential not only on the material level, but also with assemblies and system.

Assessing and improving reliability have been the driving forces in Nanotest's work which included non-destructive failure analysis early in the process. All failure analysis tools that enrich the Nanotest portfolio, today, are fruits of this journey and implement nothing less than years of theoretical research with academic partners and practical experience within the industry.

Tailor-made TTV systems engineered for unique inspection requirements. From specialized geometries and custom handling solutions to fully integrated automation concepts, Nanotest develops custom TTV platforms that combine proven measurement technology with application-specific adaptation for reliable, high-precision wafer and substrate characterization.

Specialized consulting services in the field of thermal phenomena and electronics reliability. We draw on extensive experience in research, development, and industrial collaboration since 2004.

• Test strategy development
• Material benchmarking
• Package performance testing
• Quality assessment
• Reliability and failure analysis