Thermal Interface Materials

Thermal Characterization

Thermal Interfaces are every thermal path's bottleneck. Reliability of electronic components is based on flawless heat dissipation which is jeopardized by fast-ageing, low conductive materials or poorly fitting the connection of corresponding interfaces. The right choice of materials is the key to reliable systems.

Intentionally to characterize TIMs we developed the modular measurement system TIMA™ which allows us to investigate all classes of interface materials under application-related and customer-specific conditions. The system is based on the industrial and commonly acknowledged standard ASTM D-5470.

Bulk Thermal Conductivity

This material property is probably the most popular datasheet value which is reviewed when selecting a thermal interface material. The decision often is made by comparing these values provided by the material suppliers. Because of that it is crucial to determine these material parameters in a reasonable, replicable and context sensitive manner.

Interface Resistance

The interface resistance of a TIM as equally contributes to the quality of a thermal interconnection as its bulk resistance does. This property depends on a wide range of influence like the TIM composition, its processing conditions, surface roughness, environmental characteristics and many more.


Please see Load Cycle Tests.

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Tobias von Essen

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