Non-Destructive Testing

Reliability Analyses

The assurance of reliability is closely bound to detect and investigate errors and defects. The non-destructive of hidden faults allows the determination of the condition of samples without impairing their functionality and is thus also suitable for quality assurance in the production and maintenance of systems during operation.

The selection of suitable measuring methods for the non-destructive testing is big. Our methods are imaging and non-destructive and make use of the optical properties of heat and heat flux. We help you make the right choice.

Infrared thermography

Using transient methods based on infrared thermography, hidden errors can be detected and localized. By means of high-quality optics, the resolution of structures below 10 ?m is possible, close to the physical limit caused by infrared wavelengths. Available methods include:

  • Pulse thermography
  • Pulse phase thermography
  • Lock-in thermography

The only problem: samples usually have to be blackened. This is done by means of a special optical lacquer which can be completely removed by rinsing with alcohol.

Thermoreflectance thermography

Reflective surfaces and specimens, which must not be lacquered, represent an insurmountable obstacle to the measurement using infrared-based methods. Thermoreflectance thermography uses the temperature dependence of the reflectivity of reflecting or sufficiently smooth surfaces and does not require any surface treatment. This makes the thermoreflectance a non-destructive test method par excellence.

From the determination of temperature fields on the surface to the detection of smallest errors, the thermoreflectance thermography offers the same applications as infrared thermography. By using shorter wavelengths for excitation and measurement, up to ten times smaller structure widths can be solved than with infrared-based methods. A few advantages of thermoreflectance thermography at a glance:

  • High spatial resolution (up to 500 nm)
  • No temperature limits
  • No painting or other surface treatment necessary 

Scanning Acoustic Microscopy

A well-established method is the investigation of solid samples using ultrasonic waves. Ultrasonic microscopy detects hidden interfaces and can depict them with high contrast. The samples must be measured under DI water in order to ensure an optimum sound coupling. For most samples, however, this is not a problem and allows fast test results with high reliability.

Transient thermal analysis

The transient analysis of packages, also known as thermal impedance spectroscopy, is a non-destructive testing method without imaging that provides insight into the thermal path of an assembly. Especially in the context of quality assurance, this method is of great advantage since slight changes in the heat flow, which result, for example, by microcrack evolution, can already be recognized and located.


Infraredno limitationsresolution up to 10 µm
frame rates up to 10 kHz
blackening the surface
for accuracy
Thermoreflectancereflective surfacesresolution up to 500nm
image rates up to 100 Hz
absolute temperatures
only after calibration
Ultrasoundno restrictionsfast and realiabletest is performed under
DI water
Transient Th. Analysispackages and systemsthermal path resolutionactive component required

Your advantages

We offer a wide-ranging selection of non-destructive and mostly imaging analysis methods whose use has contributed valuable results in numerous projects. Present your samples, and we will perform suitable analyses for you.

Your personal contact:

Contact Portrait

Dan Wargulski

Research & Development

Get in touch with us