TIFAS
Thermal Imaging-based Failure Analysis System
We like to categorize things. Some aspects, however, may lie hidden below the surface. Good thing, TIFAS IR can help us decide.
As the thermal behavior is key to the reliability of electronic components, it makes a lot of sense to oberve that behavoir directly to retrieve information about reliability. With the aid of infrared thermography, various defects are detectable in saples, while also being localized and quantified, especially those flaws that directly affect the thermal behavior. Furthermore, this method is 100% non-destructive and contactless.
TIFAS IR is the first all-in-one system for IR thermography for failure analysis that fits a desktop and brings everything it takes to failure-analyze electrical components, mechanical parts or joints. Defects in focus may be:
- Voids
- Cracks
- Delamination
- Inclusions
Defects detected at lightning speed
TIFAS IR brings laboratory and academic failure analysis down to desktop-scale. With the aid of thermographic methods such as pulse and pulse-phase as well as lock-in thermography, paired with intelligent image processing, within seconds and parlty automated a decision on a sample's integrity can be made. The use of a flash lamp as excitation source plays an important role to conduct pulse thermography quickly and reliably.
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This IR image shows a large-area delamination in the sinterd silver layer under a DCB substrate. Already a delamination of less than 1 mm diameter is clearly visible.
The entrapped air in a carbon fiber reinforced polymer caused by insufficient evacuation are clearly visible. Size: between 0.5 and 2 mm.
The investigation of multiple components at once can massively accelerate quality assessment. Visible defect sizes start at 10 µm, depending on their vertical position.
