Publications & Presentations


Within the framework of our scientific and technical work, we are always striving to provide impulses on a German-wide and international level and to contribute actively to the exchange of knowledge with our articles, posters and lectures. We therefore regularly present our results and our current portfolio - among others - at the following trade fairs and conferences:

Below you will find a selection of our activities in this belong.


Awards

  • Best Paper Award ITherm 2017 (coauthor)
    • B. Wunderle, M. Abo Ras et al.: Non-destructive in-situ monitoring of delamination of buried interfaces by a Thermal Pixel (Thixel) Chip
  • Best Paper Award THERMINIC 2015
    • M. Abo Ras, D. May et al.: “LaTIMA” an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials
  • EUCEMAN Honorary Membership
    • T. Winkler, for outstanding contributions to reliability research, Feb. 2015
  • Best Paper Award ITherm 2014 (coauthor)
    • B.Wunderle, M. Abo Ras et al.: Double-SidedCooling and Transient Thermo-Electrical Management of Silicon on DCB Assemblies for Power Converter Modules: Design, Technology and Test
  • Outstanding Paper Award ITherm 2010 (coauthor)
    • B. Wunderle, M. Abo Ras et al.: Advances in Thermal Interface Technology: Mono-Metal Interconnect Formation, Processing and Characterisation

List of Publications

2018

  • Presentations at 7th Electronics System-Integration Technology Conference (ESTC), Dresden, Sep. 2018
    • C. Grosse, M. Abo Ras et al.: Thermal characterization of thermal interface materials using the three-omega method
    • P. Panchal, T. von Essen et al.: Accurate, versatile and compact transient measurement system for fast thermal package characterization and heath monitoring
  • Presentation at Thermosetting Resins 2018, Berlin, Sep. 2018
    • C. Grosse, M. Abo Ras et al.: A novel sensor platform for thermal property measurements of thermosetting resins using the three-omega method
  • Presentation 14th Quantitative InfraRed Thermography Conference (QUIRT), Berlin, June 2018
    • R. Wargulski, T. Nowak et al.: Quality management of Laser cladding processes for additive manufacturing by new methods of visualization and evaluation of thermographic data
  • Co-authorship at Nordic Conference on Microelectronics Packaging (NordPac 2018), Oulu, Finland, June 2018
    • Kristiansen, S. Helland et al.: Electrical and Thermal Conduction of Isotropic Conductive Adhesive based on Novel Conductive Particles
  • Tutorial at SMT 2018, Nürnberg, June 2018
    • C. Grosse, M. Abo Ras et al.: Tutorial 6: Thermal management and reliability for electronic systems: Modern concepts of thermal characterization, failure analysis and Technology
  • Presentation at the 63rd Meeting of the Work Group for Systems Reliability of Assembling Technologies, Nürnberg, June 2018
    • M. Abo Ras: Messtechnik für Materialcharakterisierung oder Package-Analyse
  • Presentation at ITHERM 2018, San Diego, USA, May/June 2018
    • C. Grosse, M. Abo Ras et al.: Rapid Thermal Characterization of Materials with Ultra-High Resolution of Droplet Size Specimens using the Three-Omega Method
  • Co-authorship at Presentations during workshops, USA and Canada, April 2018
    • D. Saums, T. Jensen et al.: Mechanical insertion and thermal Performance testing Evaluation of metallic TIMs for semiconductor test and burn-in applications
    • A. Moscicki, A Kinart und M. Abo Ras: New thermal management solution with sinterable TIM materials
  • Presentation and co-authorship at 13th IMAPS ATW Thermal, La Rochelle, France, Feb. 2018
    • C. Grosse und M. Abo Ras: Novel characterization system for thermal conductivity and diffusivity measurement based on the Three Omega Method
    • D. Saums, T. Jensen et al.: Mechanical insertion and reliability testing of TIMs for semiconductor test and burn-in applications

2017

  • Presentations at IMAPS Autumn Conference 2017 Munich, Oct. 2017
    • C. Grosse, M. Abo Ras et al.: Entwicklung eines Messsystems zur thermischen Charakterisierung mittels bidirektionaler 3-omega-Methode
    • D. Wargulski, M. Abo Ras et al.: „TIMAwave” ein innovatives Messsystem zur Bestimmung der Temperaturleitfähigkeit von Feststoffen bei hohen Temperaturen
  • Presentation at 6th EuWoRel Berlin, Sep. 2017
    • P. Panchal, M. Abo Ras: Thermal characterization of vertically-aligned Carbon nanotubes based TIM at demonstrator level
  • Presentations and tabletop exhibition at 23rd THERMINIC 2017 Amsterdam, Netherlands, Sep. 2017
    • C. Grosse, M. Abo Ras et a.: Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-Omega Method
    • M. Abo Ras, T. von Essen et al.: Design and realization of a characterization demonstrator to investigate thermal performance of vertically-aligned carbon nanotubes TIM for avionics and aerospace applications
    • M. Abo Ras, D. Wargulski et al.: “TIMAwave” - an innovative test platform for thermal diffusivity measurement of solid materials at high temperature
  • Presentation at DGzfP/VATh Thermography Colloquium Berlin, Sep. 2017
    • D. May, M. Abo Ras et al.: microWatt Wärmequelle für Kalibrierung und Benchmark von IR-LockIn-Systemen
  • Coauthorship at IMAPS New England 4th Symposium & Expo Boxborough, USA, May 2017
    • M. Abo Ras, D. Saums: Thermal Test Chip for thermal characterization and qualification of materials, packages and systems
  • Coauthorship at ITherm 2017 Lake Buena Vista, USA, May 2017
    • B. Wunderle, M. Abo Ras et al.: Non-destructive in-situ monitoring of delamination of buried interfaces by a Thermal Pixel (Thixel) Chip
  • Presentation and vendor exhibition at EuroSimE 2017 Dresden, Apr. 2017
    • M. Abo Ras et al.: Advanced techniques for thermal characterization of materials and packages
    • J. Auersperg et al.: Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
  • Presentation at 12th IMAPS ATW La Rochelle, France, Feb. 2017
    • M. Abo Ras et al.: TIMAwave – a novel test stand for thermal diffusivity measurement based on the Angstrom’s method

2016

  • Presentation at ESREF 2016 Halle/Saale, Sep. 2016
    • J. Auersperg et al.: Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
  • Presentation at ITherm 2016 Las Vegas, USA, Jun. 2016
    • M. Abo Ras, D. May et. al: Processing-structure-property correlations of sintered silver
  • Poster presentation at PCIM Europe 2016 Nuremberg, May 2016
    • T. von Essen, M. Abo Ras et al.: Investigation of the influence of ageing processes on thermal characteristics of an IGBT power module by means of transient thermal analysis
  • Presentations at 11th IMAPS Workshop on Micropackaging and Thermal Management La Rochelle, France, Feb. 2016
    • M. Abo Ras et al.: Thermal and electrical characterization of sintered silver die attach
    • T. von Essen, M. Abo Ras: Thermal material characterization by means of transient thermal analysis techniques
  • Poster presentation at Microreliability Workshop Fraunhofer ENAS, Chemnitz, Jan. 2016
    • T. von Essen: Thermal Material and System Characterization

2015

  • Presentation at ECPE Workshop "Advances in Thermal Materials and Systems for Electronics" Nuremberg, Dec. 2015
  • Presentation at the Technical Forum on Electronics Cooling for Modern Power Applications Regensburg, Sep. 2015
  • Presentations and tabletop exhibition at 21. THERMINIC Paris, France, Sep. 2015
    • M. Abo Ras, D. May et al.: "LaTIMA" - an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach and substrate materials
    • R. Schlag, M. Abo Ras et al.: Precision determination of thermoreflectance coefficients for localized thermometry
  • Presentations at EuroSimE 2015 Budapest, Hungary, Apr. 2015
    • E. Merten, T. von Essen et al.: Reliability investigation and design of high power converter modules based of material characterization simulation and experimental verification
  • Presentation at Hannover Messe in the context of "Nanotechnology - Made in Germany" Hannover, Apr. 2015
  • Presentations at 10th IMAPS Workshop on Micropackaging and Thermal Management LaRochelle, France, Feb. 2015
    • M. Abo Ras et al.: Thermal characterization of metals, highly conductive substrates and die attach materials using steady state technique
    • T. von Essen, R. Schacht et al.: Transient thermal measurement and alaysis techniques of high power modules for determination of heat transfer coefficient at different ambient conditions

2014

  • Presentation at 20th THERMINIC Greenwich, UK, Sep. 2014
    • M. Abo Ras, D. May et al.: Thermal characterization of higly conductive die attach materials
  • Presentations at ITherm 2014 Orlando, USA, May 2014
    • M. Abo Ras, D. May et al.: Limitations and accuracy of steady state technique for thermal characterization of thermal interface materials and substrates
    • B. Wunderle, M. Springborn et al.: Double-sided cooling and transient thermo-electrical management of silicon on DCB assemblies for power converter modules: design, thechnology and test
  • Presentation at EuroSimE 2014 Gent, Belgium, Apr. 2014
    • M. Abo Ras, B. Wunderle et al.: Limitations and accuracy of steady state technique for thermal characterization of solid and composite materials
  • Contribution to PLUS Magazine March 2014
  • Presentation and tabletop exhibition at IMAPS Workshop on Micropackaging and Thermal Management La Rochelle, France, Feb. 2014
    • M. Abo Ras et al.: Development and fabrication of a thin film thermal test chip for thermal characterization and qualification of materials and packages
  • Contributions to the textbook "Smart Systems Integration with Micro- and Nanotechnologies" (Ed. B. Michel) ISBN 978-3-932434-78-5, Dresden, 2014

2013

  • Presentation at IMAPS Autumn Conference Munich, Oct. 2013
    • T. von Essen et al.: Charakterisierung von thermoelektrischen Kühlern auf Element- und Systemebene
  • Presentations and poster at 19th THERMINIC Berlin, Sep. 2013
    • M. Abo Ras, G. Engelmann et al.: Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization
    • E. Merten, M. Abo Ras et al.: Combined Method for thermal characterization of high power semiconductors
    • F. Schindler-Saefkow, F. Rost et al.: Stress impact of thermal-mechanical loads measured with the stress chip
  • Presentation at 4th GMM Synopsium AmE 2013 - Automotive meets Electronics Dortmund, Feb. 2013
  • Presentation at DVS Synopsium Weichlöten Hanau, Feb. 2013
  • Presentations and poster at internation Synopsium MicroCar Leipzig, Feb. 2013
    • M. Abo Ras, R. Schacht et al.: Thermische und thermo-mechanische Charakterisierung von thermischen Interface-Materialien
    • G. Engelmann, M. Abo Ras et al.: Herstellungstechnologie eines modularen Dünnfilm-Thermotest-Chips
    • E. Merten, T. von Essen et al.: Thermische Charakterisierung von Peltier-Kühlern
    • M. Abo Ras, E. Merten et al.: Untersuchung des Temperaturverhaltens von Hochleistungsdioden durch Experiment und Simulation
    • F. Luczak, M. Dost et al.: Authentifizierung sicherheitsrelevanter Bauteile und Produkte - der eunzigartige Fingerabdruck industrieller Erzeugnisse
    • B. Michel, T. Winkler: EUCEMAN - a powerful promoter of micro- and nanoreliability research

2012

  • Presentation at CESA Automotive Electronics Conference Paris, Dec. 2012
  • Presentation at 4th IQPC Pharma Track and Trace Cologne, Nov. 2012
  • Presentation at 22nd International Science Conference Mittweida (IWKM) Oct. 2012
  • Presentation at IMAPS Autumn Conference Munich, Oct. 2012
    • M. Abo Ras, G. Engelmann et al.: Innovative Charakterisierungsplattform zur Bewertung neuartiger thermischer Interfacekonzepte
  • Presentations at 11th Chemnitzer Synopsium on Micro Systems Technology Chemnitz, Oct. 2012
  • Presentation at 18th THERMINIC Budapest, Hungary, Sep. 2012
  • Presentation and poster at MSE Darmstadt, Sep. 2012
  • Presentation at Nanoscience Lichtenwalde, Apr. 2012
    • M. Abo Ras, R. Schacht et al.: Test stand for the characterization of Thermal Interface Materials from the macro level up to the nano level
    • T. Winkler, B. Michel: EUCEMAN — The European Center on MicroNanoReliability
  • Poster at 1st Biotechnology World Congress Dubai, Feb. 2012
  • Keynote presentation at IMAPS Workshop on Micropackaging and Thermal Management La Rochelle, France, Feb. 2012
    • M. Abo Ras, R. Schacht et al.: Universal test system for the characterization of the most common thermal interface materials

2011

  • Presentation at 3rd IQPC Pharma Track and Trace Potsdam, Nov. 2011
  • Presentation at 17th International Workshop THERMINIC Paris, France, Sep. 2011
    • M. Abo Ras, R. Haug et al.: Combined and accellerated in-situ measurement for reliability and aging analyses of thermal interface materials
    • T. Nowak, R. Schacht et al.: Approach for lifetime-estimation of plated through holes in organic boards
  • Presentation at Microtech Conference and Expo 2011 Boston, USA, Jun. 2011
    • M. Abo Ras, R. Haug et al.: Automated test system for in-situ testing of reliability and aging behaviour of thermal interface materials
  • Presentations at Synopsium MicroCar 2011 Leipzig, March 2011
    • M. Abo Ras, R. Schacht et al.: Standardisierte Charakterisierung von Thermischen Interface-Materialien mit dem TIMA-Tester
    • E. Kaulfersch, B. Brämer, et al.: Stacke Chips on MEMS — zuverlässige Miniatursensoren

2010

  • Poster presentation at VDE-Kongress E-mobility Leipzig, Nov. 2010
  • Poster presentation at Innovation Forum Mikro-Nano-Integration Erfurt, Nov. 2010
  • Presentation at 16th International Workshop THERMINIC Barcelona, Spain, Oct. 2010
    • M. Abo Ras: Influences of technological processing and surface finishing on thermal behaviour of thermal interface materials
  • Presentation at German-Polish Workshop on Reliability of Microcomponents and Microsystems Chemnitz, Sep. 2010
  • Measurement system presentation at ICT Exhibition Brussels, Sep. 2010
  • Poster presentation at Synopsium on Reliability and Design Wildbad Kreuth, Sep. 2010
    • M. Abo Ras: IR-Thermografie zur Qualitätssicherung von elektrischen Durchkontaktierungen in Leiterplatten

vor 2010

  • Presentation at 15th International Workshop THERMINIC Leuven, Belgium, Oct. 2009
  • Presentation at Polytronic Garmisch-Partenkirchen, Aug. 2008
  • Contribution to mst news Vol. 4/2008
  • Presentation at Safety and Security Systems in Europe Potsdam, Jun. 2008
  • Presentation at SMART SYSTEMS INTEGRATION Barcelona, Spain, Apr. 2008
  • Presentation at Silicon Saxony Day Dresden, Apr. 2008
  • Presentations at Synopsium MicroCar Leipzig, Feb. 2008
  • Presentation at Chemnitzer Techical Day on Micro Systems Technology Chemnitz, Nov. 2007
  • Presentations at Synopsium NanoScience Lichtenwalde, Oct. 2007
  • Presentations at 1st Word Congress MicroNanoReliability Berlin, Sep. 2007
  • Presentation at Micro Systems Technology Congress Dresden, Okt. 2007
  • Presentation at Safety and Security Systems in Europe Potsdam, Nov. 2006
  • Presentation at Fachtagung MicroCar Leipzig, Jun. 2005
  • Exhibition at EuroSimE Berlin, Apr. 2005