The system is ideally suited for R&D and validation workflows, enabling engineers to compare materials, evaluate interface performance, measure bulk thermal conductivity, and analyze how thermal resistance varies with pressure, temperature, and bond-line thickness.
Optimized for Thermal Characterization of
Gap fillers
Greases
Pads
Foils
Underfills
Substrates
System Specs:
- ASTM D5470-17 compliant steady-state thermal characterization
- Compact benchtop format with 42.3 × 48.3 cm² footprint and 75.2 cm height
- 50 kg system weight and 600 W power consumption
- Supports 13–25.4 mm round samples and 10–25.4 mm square samples
- Handles sample thicknesses from 0.001–40.0 mm
- Applies -300 … 300 N continuous force and -450 … 450 N short-term force
- Measures BLT with 1 µm precision
- Covers 20–150 °C sample temperature range
- Provides 1.0 mm²K/W thermal resistance resolution
- Supports automated testing varying either a thermal or mechanical parameter
Unparalleled Precision
Samples are measured between two metal test heads that are known in geometry and physical properties. Measuring both temperature gradient ΔT over and heat flow through the sample returns its effective thermal resistance Rtheff.Samples are measured between two metal test heads that are known in geometry and physical properties. Measuring both temperature gradient ΔT over and heat flow through the sample returns its effective thermal resistance Rtheff.
Repeating such measurement for multiple sample thicknesses allows to calculate the following linear fit to receive the sample’s bulk thermal conductivity.